Transient EM/Circuit Co-Simulation

TVS Diodes

TVS diodes are often used in the RF frontend or along data lines to protect sensitive circuitry from an ESD event. Manufacturers provide an equivalent SPICE model consisting of diodes, resistors, capacitors, and inductors to model the VI characteristics of the physical diode. XF’s nonlinear circuit solver is able to handle unidirectional diodes, bidirectional diodes, and other ESD mitigation devices which are represented as an equivalent SPICE circuit.

Chip Components

Two-port, surface mounted passive chip components are commonly used in PCB design.  Rather than using ideal components in an FDTD simulation, realistic chip performance can be simulated based on measured data.  Manufacturers -- such as Murata, Coilcraft, and Taiyo Yuden -- provide SPICE models for their chips, which can be imported into XF and used as circuit component definitions.  During timestepping, XF’s circuit solver updates the cell edge containing the component based on the SPICE model.

Read additional documentation on XF's Netlist Component Definition...